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Packging cleaning Packging cleaning
Flip chip cleaning
Flip chip

Flip chip cleaning

Flip chip cleaning: After reflow soldering the flip chip onto the substrate, the bare chip needs to be filled with filler material. Therefore, any residual solder will cause interface defects such as layering, voids, and stripes in the filling effect. So the residual flux in the narrow space between the chip and substrate is an indispensable process. The cleaning agent developed by Heming Technology has efficient cleaning and penetration capabilities, removing residues and effectively preventing delamination and stripe defects; After cleaning, it can provide appropriate moisture for the bottom filling of the flip chip, effectively preventing the formation of voids.

Unibright provides you with professional water-based cleaning solutions for flip chip processes.

Unibright Flip chip cleaning advantages

1. The pH value is neutral, demonstrating excellent material compatibility with sensitive materials such as aluminum, copper, nickel, plastic, and labels.

2. Diluted with deionized water in a certain proportion, it is not easy to foam and can be used in spray and ultrasonic processes.

3. Halogen free, environmentally friendly materials; The odor is light, the liquid used has no flash point, and it is safe to use without the need for additional explosion-proof measures.

4. Due to its neutral pH, it reduces the difficulty of sewage treatment.

Flip chip cleaning recommended products

Flip chip cleaning application

Used to remove flux, solder paste, and solder paste residues from PCBA, packaging devices, and power electronics. This product can effectively remove solder paste, solder paste, and flux residues on various semiconductor electronic devices. For flip chip, semiconductor packaging water-based environmental cleaning, PoP stacked chips, SIP system packaging, semiconductor chips, semiconductor power devices, power modules (photoelectric modules, sensing modules, communication modules), power electronics, IGBT power modules, DCB power cleaning, lead frame, BGA ball planting cleaning, discrete devices Electronic components and other components have excellent cleaning effects.

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