For reference only, subject to actual
➤ When using wave soldering equipment, it is recommended to preheat the PCB board at a temperature of 90 ℃ -110 ℃ to maximize the effectiveness of the soldering flux.
➤ During the spray operation of the flux roller, the specific gravity shall be strictly controlled, and the diluent shall be properly added to make it use within the standard specific gravity range (0.80 ± 0.02).
➤ The soldering solder wave should be flat and minimize the deformation of the PCB board as much as possible, so that the soldering time of each solder point is basically consistent, in order to achieve a more uniform surface effect.
➤ Pay attention to the adjustment of the nozzle during spray operation, and ensure that the flux is evenly distributed on the PCB surface.
➤ The compressed air that is degreased, dewatered and cooled shall be used to spray, and the pressure of the compressed air shall be kept stable to avoid the instability of the spray. When the flux becomes muddy or there is suspended solids in the liquid, the flux in the pan shall be removed in time, the flux pan shall be cleaned, and the flux pan shall be replaced.