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Electronics cleaning Electronics cleaning
Power module components cleaning
Power module components

Power module components cleaning

At present, 5G communication and new energy vehicles are in full swing, and power devices and semiconductor chips are their core components. To ensure the quality and high reliability of power devices and semiconductor chips, it is necessary to introduce cleaning processes and use cleaning agents before packaging.

Before packaging power devices and semiconductors, flux and solder paste are usually used as welding aids. These aids will have some residue during the welding process, including pollutants such as fingerprints, sweat, keratin, and dust contaminated during the manufacturing process.

At the same time, the lead frames of power devices and semiconductors are assembled with fragile functional materials such as sensitive metals such as aluminum, copper, platinum, and nickel. These sensitive metals and special functional materials have high requirements for the compatibility of cleaning agents.

In general, cleaning agents with poor material compatibility are prone to adverse phenomena such as oxidation, discoloration, swelling, deformation, or detachment of sensitive materials. Water based cleaning agents are environmentally friendly cleaning agents developed for wire frames, power semiconductor devices, discrete devices, IGBT modules, power modules (optoelectronic modules, sensing modules, communication modules), and reflow soldering DCB post soldering cleaning. They have good material compatibility and high cleaning efficiency, and can clean residual materials such as solder paste, flux, and solder paste to avoid damage to sensitive materials.

Unibright Power module components cleaning advantages

1. The pH value is neutral, demonstrating excellent material compatibility with sensitive materials such as aluminum, copper, nickel, plastic, and labels.

2. Diluted with deionized water in a certain proportion, it is not easy to foam and can be used in spray and ultrasonic processes.

3. Halogen free, environmentally friendly materials; The odor is light, the liquid used has no flash point, and it is safe to use without the need for additional explosion-proof measures.

4. Due to its neutral pH, it reduces the difficulty of sewage treatment.

Power module components cleaning recommended products

Power module components cleaning application

Used to remove flux, solder paste, and solder paste residues from PCBA, packaging devices, and power electronics. This product can effectively remove solder paste, solder paste, and flux residues on various semiconductor electronic devices. For flip chip, semiconductor packaging water-based environmental cleaning, PoP stacked chips, SIP system packaging, semiconductor chips, semiconductor power devices, power modules (photoelectric modules, sensing modules, communication modules), power electronics, IGBT power modules, DCB power cleaning, lead frame, BGA ball planting cleaning, discrete devices Electronic components and other components have excellent cleaning effects.

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