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Electronics cleaning Electronics cleaning
IGBT power module cleaning
IGBT power module

IGBT power module cleaning

IGBT power module cleaning: There are interface bonding issues in the IGBT manufacturing process, such as parallel connection of IGBT chips, connection between chips and DCB substrates, encapsulation of insulating silicone, and overall packaging of power modules. Cleaning the interface before bonding is the most direct and effective method to solve the low reliability of IGBT power modules. Unibright provides water-based cleaning process solutions that remove 100% of interface residues, providing ideal interface bonding conditions for the next process; At the same time, water-based cleaning agents have excellent material compatibility with the chip protective layer and substrate, significantly improving the reliability of the product.

Unibright provides you with professional water-based cleaning solutions for IGBT power modules.

Unibright IGBT power module cleaning advantages

1. The pH value is neutral, demonstrating excellent material compatibility with sensitive materials such as aluminum, copper, nickel, plastic, and labels.

2. Diluted with deionized water in a certain proportion, it is not easy to foam and can be used in spray and ultrasonic processes.

3. Halogen free, environmentally friendly materials; The odor is light, the liquid used has no flash point, and it is safe to use without the need for additional explosion-proof measures.

4. Due to its neutral pH, it reduces the difficulty of sewage treatment.

IGBT power module cleaning recommended products

IGBT power module cleaning application

Used to remove flux, solder paste, and solder paste residues from PCBA, packaging devices, and power electronics. This product can effectively remove solder paste, solder paste, and flux residues on various semiconductor electronic devices. For flip chip, semiconductor packaging water-based environmental cleaning, PoP stacked chips, SIP system packaging, semiconductor chips, semiconductor power devices, power modules (photoelectric modules, sensing modules, communication modules), power electronics, IGBT power modules, DCB power cleaning, lead frame, BGA ball planting cleaning, discrete devices Electronic components and other components have excellent cleaning effects.



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