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Application of water-based cleaning agents in cleaning fingerprint module and camera modules

Unibright 👁 1857 Tags:摄像模组清洗

Application of water-based cleaning agents in fingerprint module cleaning of camera modules

 

Key words in the article: water-based cleaning agent, camera module cleaning, fingerprint module cleaning, PCBA circuit board cleaning

 

1 Application fields of camera modules




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2、 Construction of camera module


The camera module mainly consists of four parts: lens, sensor, backend image processing chip, and soft board. The module is a crucial electronic device for image capture, and the cleanliness of the device determines the effectiveness of the module's use. There is a high requirement for component cleanliness during the production process.



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3、 The Results and Characteristics of the Development of Camera Modules




1. The perception and processing of signals are weaker and more sensitive. This requires smaller background noise and cleaner PCBs;




2. Higher working frequency and wider bandwidth. This requires higher consistency in the circuit environment and fewer foreign objects that cause interference;




3. The introduction of lighter and smaller components, such as 0201 and even smaller chip components<. li>




4. Higher assembly density, such as component spacing less than 0.2mm;




5. Introduction of new devices with different structures and concealed solder joint cleaning areas, such as microBGAs, Flip Chips, etc




6. Higher voltage resistance trend




7. Adaptability to harsher working environments, etc



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4 Corresponding cleaning process requirements

 

 

 

1. Requirements for cleaning agents

 

 

 

a. Choose a cleaning agent that matches the flux used

 

 

 

b. Cleaning agents can adapt to different situations without being unable to adapt due to minor changes in production processes

 

 

 

c. Require the cleaning agent to have low viscosity and good fluidity to adapt to the cleaning of micro gaps

 

 

 

d. The cleaning agent provider has sufficient technical reserves and can provide strong technical support

 

 

 

e. Low cost

 

 

 

 

 

2. Requirements in process and equipment

 

 

 

a. Capable of high precision, high density, and assembling high-tech components such as microBGAs and Flip Chips for high cleanliness and cleanliness cleaning

 

 

 

b. Non toxic, low toxic, fireproof, explosion-proof

 

 

 

c. Solvent internal circulation, low discharge

 

 

 

d. Parameter self-control, especially cleanliness self-control

 

 

 

 

 

3. Compared to traditional solvent cleaning agents, water-based cleaning agents are reflected in the following aspects:

 

 

 

a. Safe to use, no flash points;

 

 

 

b. Non toxic, with minimal harm to the human body;

 

 

 

Long cleaning life and relatively low cost;

 

 

 

c. Can thoroughly and effectively remove various residues, meeting the requirements of high-precision, high-density, and high cleanliness cleaning;

 

 

 

Residues such as: cleaning of solder paste residue, cleaning of flux residue, polar pollutants, non-polar pollutants, ionic pollutants, dust, fingerprints, oil stains, and metal oxide layers that cannot be removed by solvent cleaning agents (see Figure 1 and Figure 2).



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5 Environmental cleaning process

 

Efficient, high specification, environmentally friendly and safe water-based cleaning technology is the most ideal choice, and it is also the development direction and necessary path of the future cleaning industry.

 



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